Viscoplastic Constitutive Equations for Tin-Lead Eutectic Solder Alloy

Ying Yong Li Xue Xue Bao/Chinese Journal of Applied Mechanics

Volumn 15, Issue 2, 1998, Pages 87-90

  Ma, Xin ^a   Wang, Li ^a   Fang, Hongyuan ^a   Qian, Yiyu ^a  

^a NONE

Author keywords

Constitutive equation; Mathematical simulation; Sn60 Pb40 eutectic solder alloy; Viscoplastic

Indexed keywords

EID: 0346310856     PISSN: 10004939     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. T. G. Langdon. Deformation at high temperature in strength of metals and allogys: Proc 6th Int Conf, Aug. 1982:1105-1120
2. S. T. Lam et al. Superplastic Behawor of Pb-Sn Eutectic Alloy. Mater Sci Engng, 1979(40): 73-79
3. B. P. Kashgap and G. S. Murty. Experimental Constitutive Relations for the High Temperature Deformation of a Pb-Sn Eutectic Alloy. Mater Sci Engng. 1981(50): 205-213
4. S. R. Bodner and Y. Partom. Constitutive Equatrons for Elastic-Viscoplastic Strain Hardening Matericels. ASME J Applied Mech, 1975, 42: 385-389
5. A. Merzer. Analytical Formalation of a Rate and Temperature Dependent Stress-Strain Relation. ASME J Engng Mater Tech, 1979, 99:254-257
6. E. P. busso et al. A Visco-plastic Constitutive Model for 60/40 Tin-Lead Solder used in IC Package Jovhts. ASME J Engng Mater Tech, 1992, 114: 331-337