Time and spatial resolved detection of power device failures during wire bonding

2006 4th International Conference on Integrated Power Systems, CIPS 2006

Volumn , Issue , 2006, Pages

  Siepe, Dirk ^a   Bayerer, Reinhold ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

INSULATED GATE BIPOLAR TRANSISTORS (IGBT); STRESSES; WIRE;

ALUMINUM WIRES; BOND PROCESS; BONDING QUALITY; POWER DEVICES; POWER SEMICONDUCTOR MODULE; SEMI-CONDUCTOR SURFACES; THERMO-MECHANICAL STRESS; WIRE BONDING;

POWER SEMICONDUCTOR DEVICES;

EID: 84872381179     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Held, M. et al.: Fast Power Cycling Test for IGBT Modules in Traction Application, Proc. Power Electronics and Drive Systems 1997, pp. 425-430
2. SchOtze, T., Berg, H., Hierholzer, M.: Further Improvements in the Reliability of IGBT Modules. IEEE Industry Applications Conference, Vol. 2, pp 1022-1025
3. Harmann, George: Wire Bonding in Microelectronics. New York, McGraw-Hill, 1997