A bimodal three-parameter lognormal mixture distribution for electromigration failure analysis

Thin Solid Films

Volumn 516, Issue 23, 2008, Pages 8804-8809

  Tan, Cher Ming ^a   Raghavan, Nagarajan ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electromigration; Incubation time; Lognormal model; Mixture distribution; Simulated annealing

Indexed keywords

ANNEALING; CODES (SYMBOLS); ELECTROMIGRATION; GLOBAL OPTIMIZATION; MATHEMATICAL PROGRAMMING; MECHANISMS; MIXTURES; OPTIMIZATION; QUALITY ASSURANCE; SAFETY FACTOR;

INCUBATION TIME; LOGNORMAL MODEL; MIXTURE DISTRIBUTION; MIXTURE DISTRIBUTIONS;

SIMULATED ANNEALING;

EID: 51049089106     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.06.078     Document Type: Article

References (11)

1. Zhang G., Tan C.M., Tan K.T., Sim K.Y., and Zhang W.Y. Microelectron. Reliab. 44 (2004) 1843
2. Christiansen C.J., Li B., Gill J., Filippi R., and Angyal M. IEEE Trans. Device Mater. Reliab. 6 (2006) 163
3. Oates A.S., and Lee S.C. Microelectron. Reliab. 46 (2006) 1581
4. Fischer A.H., Abel A., Lepper M., Zitzelsberger A.E., and Glasow v. Microelectron. Reliab. 41 (2001) 445
5. Wood M.H., Bergman S.C., and Hemmert R.S. 29th Annual Proceedings of the IEEE International Reliability Physics Symposium (April 9-11, 1991) 70 Las Vegas, Nevada
6. Li B., Yashchin E., Christiansen C.J., Gill J., Filippi R., and Sullivan T. Microelectron. Reliab. 46 (2006) 2049
7. Ebeling C. An Introduction to Reliability and Maintainability Engineering (1997), McGraw Hill Publishers
8. Dempster A.P., Laird N.M., Rubin D.B., and Roy J. Stat. Soc. 39 (1977) 1
9. Jiang S., and Kececioglu D. IEEE Trans. Reliab. 41 (1992) 248
10. Li Y., Yao J., and Yao D. Proceedings of the IEEE International Conference on Communication, Circuits & Systems and West Sino Expositions (June 26-28, 2002) 1165 Chengdu, China
11. Brooks S.P., and Morgan B.J.T. Statistician 44 (1995) 241