Set-level thermal management with package thermal design in digital TV application

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 598-603

  Eun, Seok Cho ^a   Choi, Mi Na ^a   Jung, Chung Hyo ^a   Yoo, Jaewook ^a   Hwang, Heejung ^a   Lee, Heeseok ^a   Choi, Kiwon ^a   Kang, Sayoon ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Ball grid array (BGA); Digital TV; Heat sink; Package thermal design; Set level thermal management (STM); Thermal pad; Thermal resistance

Indexed keywords

APPLICATIONS; DIGITAL ARITHMETIC; DIGITAL TELEVISION; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FORMING; HEAT RESISTANCE; MANAGEMENT; TELEVISION BROADCASTING; THERMOMECHANICAL TREATMENT;

BALL GRID ARRAY (BGA); DIGITAL TV; HEAT SINK; PACKAGE THERMAL DESIGN; SET-LEVEL THERMAL MANAGEMENT (STM); THERMAL PAD; THERMAL RESISTANCE;

THERMAL VARIABLES CONTROL;

EID: 50949094069     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544323     Document Type: Conference Paper

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