Thick copper pillar bump fabrication

Advanced Packaging

Volumn 16, Issue 8, 2007, Pages 28-30

  Flack, Warren W ^a,c   Nguyen, Ha Ai ^a,c   Capsuto, Elliott ^b   McEwen, Craig ^b  

^a Ultratech Inc

^b SHIN ETSU CHEMICAL CO LTD   (Japan)

^c Ultratech Stepper Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ARRAYS; COPPER PILLAR STRUCTURES;

ACETONE; COPPER; PHOTOLITHOGRAPHY; PHOTORESISTS; WAFER BONDING;

ELECTROPLATING;

EID: 37749031709     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)