Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 630-636

  Szabó, Péter ^a   Steffens, Oliver ^b   Lenz, Michael ^b   Farkas, Gábor ^a  

^a MicReD Ltd   (Hungary)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Heat conductance path; Junction to case thermal resistance measurement; Measurement repeatability; Structure functions

Indexed keywords

HEAT CONDUCTION; HEAT RESISTANCE; MOSFET DEVICES; POWER ELECTRONICS; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR JUNCTIONS; TEMPERATURE DISTRIBUTION; THERMAL VARIABLES MEASUREMENT;

HEAT CONDUCTANCE PATH; JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENT; MEASUREMENT REPEATABILITY; STRUCTURE FUNCTIONS; THERMAL TRANSIENT MEASUREMENTS;

ELECTRONICS PACKAGING;

EID: 29244451435     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.859768     Document Type: Article

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