SCOPUS 정보 검색 플랫폼

2006 International Interconnect Technology Conference, IITC

Volumn , Issue , 2006, Pages 143-145

Non-destructive electrical characterization of low-k sidewall damage before metallization by a near-field scanned microwave probe

(6) Schwartz, A R a Talanov, V V a Scherz, A a Kastenmeier, B b White, B b Satyanarayana, S b

a Neocera Inc (United States)

b SEMATECH (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; DIELECTRIC FILMS; METALLIZING; MICROWAVES; TECHNOLOGY;

ELECTRICAL CHARACTERIZATIONS; IN-LINE METROLOGY; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; LOW- K FILMS; LOW-K DIELECTRIC FILMS; METALLIZATION; NEAR FIELDS; NON-CONTACT AND NON-INVASIVE; NON-DESTRUCTIVE; NOVEL METHODS; SIDEWALL DAMAGE; SPOT SIZES;

COPPER;

EID: 50249169441 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/IITC.2006.1648671 Document Type: Conference Paper

Times cited : (1)

References (9)

1
- 0037666297
- K. Maex, M. R. Baklanov, D. Shamiryan, F. Iacopi, S. H. Brongersma, Z.S. Yanovitskaya, J. Appl. Phys. 93, 8793 (2003)
- (2003) J. Appl. Phys , vol.93 , pp. 8793
- Maex, K.¹ Baklanov, M.R.² Shamiryan, D.³ Iacopi, F.⁴ Brongersma, S.H.⁵ Yanovitskaya, Z.S.⁶

2
- 29744450305
- Intl
- A. Braun, Semicond. Intl., 28 (5), 41 (2005).
- (2005) Semicond , vol.28 , Issue.5 , pp. 41
- Braun, A.¹

3
- 28244484360
- Piscataway, NJ, USA; IEEE
- J. S. Tsai, Y. N. Su, J. W. Hsu, J. L. Yang, J. H. Shieh, S. M. Jang, M. S. Liang, Proc. IEEE 2005 International Interconnect Tech. Conf., Piscataway, NJ, USA; IEEE, 2005. p. 94-6.
- (2005) Proc. IEEE 2005 International Interconnect Tech. Conf , pp. 94-96
- Tsai, J.S.¹ Su, Y.N.² Hsu, J.W.³ Yang, J.L.⁴ Shieh, J.H.⁵ Jang, S.M.⁶ Liang, M.S.⁷

4
- 33644926042
- S. Satyanarayana, R. McGowan, B. White, and S. Hosali, Semicon. Intl., 28 (6), 63 (2005).
- S. Satyanarayana, R. McGowan, B. White, and S. Hosali, Semicon. Intl., 28 (6), 63 (2005).

5
- 28244469697
- USA, Piscataway, NJ
- Shimada, M.; Otsuka, Y.; Harada, T.; Tsutsumida, A.; Inukai, K., Hashimoto, H.; Ogawa, S. Proc IEEE 2005 International Interconnect Technology Conference, pp. 88-90, USA, Piscataway, NJ.
- Proc IEEE 2005 International Interconnect Technology Conference , pp. 88-90
- Shimada, M.¹ Otsuka, Y.² Harada, T.³ Tsutsumida, A.⁴ Inukai, K.⁵ Hashimoto, H.⁶ Ogawa, S.⁷

6
- 28244492753
- USA, Piscataway, NJ
- Iacopi, F.; Brongersma, S.H.; Mazurenko, A.; Struyf, H.; Mannaert, G.; Travaly, Y.; Maznev, A.; Abell, T.J.; Tower, J.; Maex, K. Proc. IEEE 2005 International Interconnect Technology Conference (IEEE Cat. No. 05TH8780), 2005, pp. 217-19, USA, Piscataway, NJ.
- (2005) Proc. IEEE 2005 International Interconnect Technology Conference (IEEE Cat. No. 05TH8780) , pp. 217-219
- Iacopi, F.¹ Brongersma, S.H.² Mazurenko, A.³ Struyf, H.⁴ Mannaert, G.⁵ Travaly, Y.⁶ Maznev, A.⁷ Abell, T.J.⁸ Tower, J.⁹ Maex, K.¹⁰

7
- 50249149047
- Principles of Near-Field Microwave Microscopy in Scanning Probe Microscopy: Electrical and Electromechanical Phenomena at the Nanoscale
- S. Kalinin and A. Gruverman Eds, to be published by
- S. M. Anlage, V. V. Talanov, and A. R. Schwartz, Principles of Near-Field Microwave Microscopy in Scanning Probe Microscopy: Electrical and Electromechanical Phenomena at the Nanoscale, S. Kalinin and A. Gruverman (Eds.), (to be published by Springer Verlag, 2006).
- (2006) Springer Verlag
- Anlage, S.M.¹ Talanov, V.V.² Schwartz, A.R.³

8
- 50249124631
- submitted to Appl. Phys. Lett
- V.V. Talanov, A. Scherz, R.L. Moreland, and A.R. Schwartz, submitted to Appl. Phys. Lett., 2005.
- (2005)
- Talanov, V.V.¹ Scherz, A.² Moreland, R.L.³ Schwartz, A.R.⁴

9
- 50249112195
- submitted to Appl. Phys. Lett
- V.V. Talanov, A. Scherz, R.L. Moreland, and A.R. Schwartz, submitted to Appl. Phys. Lett., 2005.
- (2005)
- Talanov, V.V.¹ Scherz, A.² Moreland, R.L.³ Schwartz, A.R.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.