Perspectives on integrated metrology and wafer-level control

IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Volumn , Issue , 2007, Pages 315-319

  Lensing, Kevin ^a   Stirton, Broc ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL PLANTS; CONTROL THEORY; INTELLIGENT CONTROL; LEVEL CONTROL; PRODUCTION CONTROL; SEMICONDUCTOR MATERIALS; TECHNOLOGY;

ADVANCED-PROCESS-CONTROL; BIAS CORRECTIONS; CONTROL PROBLEMS; CRITICAL FACTORS; INTEGRATED METROLOGY; INTERNATIONAL SYMPOSIUM; POTENTIAL BENEFITS; SEMICONDUCTOR MANUFACTURING; WAFER LEVELS; WAFER SAMPLING;

ELECTRIC CONDUCTIVITY;

EID: 50249131916     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.2007.4446829     Document Type: Conference Paper

References (4)

1. M. Sendelbach et al, "Integrated scatterometry in highvolume manufacturing for polysilicon gate etch control," SPIE Microlithography 2006, April 2006.
2. A. Braun, "Process Complexity Fuels Integrated Metrology," Semiconductor International, 7/1/2005.
3. K.R Lensing et al, "A Comprehensive Comparison of Spectral Scatterometry Hardware," SPIE Microlithography 2005, March 1, 2005.
4. th European AEC/APC Conference, March 2006.