Semiconductor integrated circuit packaging technology challenges - Next five years

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging

Volumn 2005, Issue , 2005, Pages 6-9

  Bolanos, Mario A ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE INDUSTRY; CMOS INTEGRATED CIRCUITS; DIELECTRIC MATERIALS; ELECTRONICS INDUSTRY; INTEGRATED CIRCUITS; SEMICONDUCTOR DEVICES;

ELECTRONIC END EQUIPMENTS; ELECTRONIC PRODUCTS; HETEROGENEOUS TECHNOLOGY INTEGRATION;

ELECTRONICS PACKAGING;

EID: 33847267649     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2005.1598225     Document Type: Conference Paper

References (4)

1. Rickert, Peter, ICCAD 2004 Key Note
2. Stork, Hans, SOC Conference 2005 Key Note
3. Bolanos, Mario, ECTC 2004, Low k Dielectric Panel Discussion
4. Bolanos, Mario, Electronics Goes Green Conference 2004 Key Note