Micromachining and dicing of sapphire, gallium nitride and micro LED devices with UV copper vapour laser

Thin Solid Films

Volumn 453-454, Issue , 2004, Pages 462-466

  Gu, E ^a   Jeon, C W ^a   Choi, H W ^a   Rice, G ^a   Dawson, M D ^a   Illy, E K ^b   Knowles, M R H ^b  

^a UNIVERSITY OF STRATHCLYDE   (United Kingdom)

^b OXFORD LASERS LTD   (United Kingdom)

Author keywords

Gallium nitride; Laser ablation; LED devices; Sapphire

Indexed keywords

ATTENUATION; COPPER; CURRENT VOLTAGE CHARACTERISTICS; DEPOSITION; DIELECTRIC MATERIALS; ETCHING; GALLIUM NITRIDE; LASER ABLATION; LASER PULSES; MICROMACHINING; OPTIMIZATION; SAPPHIRE; ULTRAVIOLET RADIATION;

MECHANICAL DICING; THERMAL ABLATION;

LIGHT EMITTING DIODES;

EID: 1542740508     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2003.11.133     Document Type: Conference Paper

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