Laser cutting of thick ceramic substrates by controlled fracture technique

Journal of Materials Processing Technology

Volumn 136, Issue 1-3, 2003, Pages 166-173

  Tsai, Chwan Huei ^a   Chen, Hong Wen ^a  

^a HUAFAN UNIVERSITY   (Taiwan)

Author keywords

Ceramic substrate; Controlled fracture; Laser cutting

Indexed keywords

CARBON DIOXIDE LASERS; COMPUTER SOFTWARE; CRACKS; FINITE ELEMENT METHOD; FRACTURE; LASER APPLICATIONS; LASER BEAMS; NEODYMIUM LASERS; STRESS CONCENTRATION; THERMAL STRESS;

LASER CUTTING;

CERAMIC MATERIALS;

EID: 0037431474     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00134-1     Document Type: Article

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