A vertically guided MEMS probe card with deeply recessed trench-type cantilever

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2005, Pages 271-274

  Kim, Bong Hwan ^a,b   Chung, Doo Yun ^b   Chung, Chi Hwan ^b   Chun, Tae Un ^c   Seok, Seon Ho ^a   Kim, Hyeon Cheol ^a   Chun, Kukjin ^a  

^a Seoul National University   (South Korea)

^b IC MEMS Inc   (South Korea)

^c Yulimhitech Co Ltd

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT RESISTANCE; MEMS PROBE CARDS; TRENCH-TYPE CANTILEVERS; VERTICALLY GUIDED STRUCTURES;

ELECTRIC CONTACTS; ELECTRIC RESISTANCE; LEAKAGE CURRENTS; REACTIVE ION ETCHING; SILICON;

MICROELECTROMECHANICAL DEVICES;

EID: 26844497253     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. R. Schwarte and D. Kosecki, "Advances in Probe Card Analyzer: Test and Maintenance of Very High Pin Count Cards", Southwest Test Workshop, Long beach, USA, June 2003.
2. M. Beiley, J. Leung and S. S. Wong: IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, 18 (1995) p184.
3. Y. Zhang, Y. Zhang and R.B. Marcus: IEEE Journal of MEMS, 8 (1999) p43.
4. th IEEE International Conference on Micro Electro Mechanical Systems (MEMS '01), Interlaken, Switzerland, (2001) p204.
5. th IEEE International Conference on Microelectromechanical Systems (MEMS'2002), Las Vegas, Nevada, USA, (2002) p368.