SCOPUS 정보 검색 플랫폼

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 311-314

Design and characterization of a novel ICP plasma tool for high speed and high accuracy DRIE processing

(3) Launay, N a Van Zeijl, H W b Sarro, P M b

a NOKIA RESEARCH CENTER (United States)

b DELFT UNIVERSITY OF TECHNOLOGY (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; ELECTRON BEAM LITHOGRAPHY; ETCHING; INDUCTIVELY COUPLED PLASMA; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; PHOTORESISTS; PLASMAS;

ANGULAR DEVIATIONS; COUPLED PLASMAS; DEEP-REACTIVE ION ETCHING; ETCH PROCESSING; ETCH PROFILE; ETCH RATES; HIGH SPEEDS; HIGH-ACCURACY; ICP PLASMA; INTERNATIONAL CONFERENCES; MICRO-ELECTRO MECHANICAL SYSTEMS; TEST STRUCTURES;

REACTIVE ION ETCHING;

EID: 50149089619 PISSN: 10846999 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/MEMSYS.2008.4443655 Document Type: Conference Paper

Times cited : (2)

References (6)

1
- 50149121361
- G. Marcos, Simulation numerique par methode Monte Carlo de la gravure du silicium en plasma fluoré. Etude du rôle de l'oxygène dans la passivation. Comparaison des résultats expérimentaux, These de doctorat, 2002
- G. Marcos, "Simulation numerique par methode Monte Carlo de la gravure du silicium en plasma fluoré. Etude du rôle de l'oxygène dans la passivation. Comparaison des résultats expérimentaux", These de doctorat, 2002

2
- 2642519540
- Optimized Overlay Metrology Marks:Theory and Experiment
- May
- M. Adel, M. Ghinovker, B. Golovanevsky, P. Izikson, E. Kassel, D. Yaffe, A. M. Bruckstein,R. Goldenberg, Y. Rubner, and M. Rudzsky, "Optimized Overlay Metrology Marks:Theory and Experiment", IEEE Trans. On Semiconductor Manufacturing, Vol. 17, No. 2, May 2004
- (2004) IEEE Trans. On Semiconductor Manufacturing , vol.17 , Issue.2
- Adel, M.¹ Ghinovker, M.² Golovanevsky, B.³ Izikson, P.⁴ Kassel, E.⁵ Yaffe, D.⁶ Bruckstein, A.M.⁷ Goldenberg, R.⁸ Rubner, Y.⁹ Rudzsky, M.¹⁰

3
- 0042782918
- Characterization of Front- to Backwafer Alignment and Bulk Micromachining Using Electrical Overlay Test Structures
- May
- H.W. van Zeijl, J. Slabbekoorn "Characterization of Front- to Backwafer Alignment and Bulk Micromachining Using Electrical Overlay Test Structures", Proc. SPIE, Smart Sensors, Actuators and MEMS, Vol. 5116, May 2003, pp. 617-626
- (2003) Proc. SPIE, Smart Sensors, Actuators and MEMS , vol.5116 , pp. 617-626
- van Zeijl, H.W.¹ Slabbekoorn, J.²

4
- 8844220611
- Characterization Waferstepper and Process Related Front- to Backwafer Overlay Errors in Bulk Micro Machining using Electrical Overlay Test Structures
- April
- H.W. van Zeijl, F.G.C. Bijnen, J. Slabbekoorn, "Characterization Waferstepper and Process Related Front- to Backwafer Overlay Errors in Bulk Micro Machining using Electrical Overlay Test Structures", Proc. SPIE, MEMS, MOEMS and Micromachining, Vol. 5455, April 2004
- (2004) Proc. SPIE, MEMS, MOEMS and Micromachining , vol.5455
- van Zeijl, H.W.¹ Bijnen, F.G.C.² Slabbekoorn, J.³

5
- 20044394567
- 3D align overlay verification using glass wafers
- E. M. J. Smeets, F. G. C. Bijnen , J. Slabbekoorn, H. W. van Zeijl, "3D align overlay verification using glass wafers", Proc. of SPIE The-International Society for Optical Engineering, Vol. 5641, 2004, pp. 152-162
- (2004) Proc. of SPIE The-International Society for Optical Engineering , vol.5641 , pp. 152-162
- Smeets, E.M.J.¹ Bijnen, F.G.C.² Slabbekoorn, J.³ van Zeijl, H.W.⁴

6
- 0033360674
- Multiple Linear Regression Analysis of the Overlay Accuracy Model
- May
- Z-C. Lin and W-J. Wu, "Multiple Linear Regression Analysis of the Overlay Accuracy Model", IEEE Trans. On Semiconductor Manufacturing, Vol 12 no. 2 May 1999
- (1999) IEEE Trans. On Semiconductor Manufacturing , vol.12 , Issue.2
- Lin, Z.-C.¹ Wu, W.-J.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.