Characterization of front- to backwafer alignment and bulk micromachining using electrical overlay test structures

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5116 II, Issue , 2003, Pages 617-626

  Van Zeijl, H W ^a   Slabbekoorn, J ^a  

^a DIMST   (Netherlands)

Author keywords

Bulk micromachining; Dual side alignment; Electrical overlay; Titan nitride resistor

Indexed keywords

CONDUCTIVE FILMS; ELECTRIC RESISTANCE MEASUREMENT; ETCHING; LITHOGRAPHY; MICROMACHINING; PHOTORESISTS; RESISTORS; SILICON NITRIDE; SILICON WAFERS; TITANIUM NITRIDE;

BULK MICROMACHINING; DUAL SIDE ALIGNMENT; ELECTRICAL OVERLAY TEST STRUCTURES; FRONT-TO BACKWAFER ALIGNMENT; TITANIUM NITRIDE RESISTOR;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 0042782918     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.499104     Document Type: Conference Paper

References (5)

1. Cheng Qun Gui, Willy van Buël, Frans Bijnen, Joeri Lof, Extended Front-To-Back Alignment Capability for MEMS/MOEMS Applications, Proceedings of SPIE, Vol.4688-96, March 2002
2. C.M. Cork, Off-line Photolithographic Parameter Extraction using Electrical Test Structures, Proceedings IEEE 1989 Int. Conference on Microelectronic Test Structures, Vol 2 No. 1 March 1989, p7-14
3. Alan Hastings, The Art of Analog Layout, Prentice-Hall, New Jersey, 2001, p 177
4. CRC Handbook of Chemistry and Physics, CRC Press inc. Boca Raton, Florida, 1989
5. H. W. van Zeijl, J. Slabbekoorn, Front-to Backwafer Overlay Accuracy in Substrate Transfer Technologies, Proceedings of the 1st international conference on semiconductor technology, The electrochemical society, Vol. 2001-17, May 2001, pp 356-367