On the degradation of MEMS gyroscope performance in the presence of high power acoustic noise

IEEE International Symposium on Industrial Electronics

Volumn , Issue , 2007, Pages 1435-1440

  Dean, R N ^a   Flowers, G T ^a   Hodel, A S ^a   Roth, G ^a   Castro, S ^a   Zhou, R ^a   Moreira, A ^a   Ahmed, A ^a   Rifki, R ^a   Grantham, B E ^b   Bittle, D ^b   Brunsch, J ^c  

^a AUBURN UNIVERSITY   (United States)

^b US Army AMRDEC Development   (United States)

^c MEMSense LLC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC NOISE; ACOUSTIC WAVES; ACOUSTICS; COMPOSITE MICROMECHANICS; DC GENERATORS; DEGRADATION; ELECTRONICS INDUSTRY; GYROSCOPES; INDUCTIVELY COUPLED PLASMA; INDUSTRIAL ELECTRONICS; INDUSTRIAL MANAGEMENT; MICROELECTROMECHANICAL DEVICES; SENSORS; SULFATE MINERALS; TECHNICAL PRESENTATIONS; UNDERWATER ACOUSTICS;

ACOUSTIC ENERGY; ACOUSTIC SIGNALS; ANGULAR RATE MEASUREMENTS; ANGULAR RATES; APPLICATIONS.; FREQUENCY COMPONENTS; HIGH FREQUENCIES; HIGH POWERS; HIGH-FREQUENCY VIBRATIONS; INTERNATIONAL SYMPOSIUM; MECHANICAL SHOCKS; MEMS GYROSCOPES; POWER REQUIREMENTS; PROOF MASS; REDUCED-SIZE; RESONATING FREQUENCY; SENSOR PERFORMANCES;

MEMS;

EID: 50049109222     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISIE.2007.4374812     Document Type: Conference Paper

References (15)

1. M. -H. Bao, Handbook of Sensors and Actuators, Volume 8, Micro Mechanical Transducers, Pressure Sensors, Accelerometers and Gyroscopes. S. Middelhoek, Ed. New York: Elsevier Science B. V., 2000, pp. 362-365.
2. R. Dean, G. Flowers, N. Sanders, R. Horvath, M. Kranz, and M. Whitley, "Micromachined vibration isolation filters to enhance packaging for mechanically harsh environments," in J. Microelectronics and Electronic Packaging, vol. 2, no. 4, 2005, pp. 223-231.
3. T. G. Brown, "Harsh military environments and microelectromechanical (MEMS) devices," in Proc. of IEEE Sensors, Oct 22-24 2003, pp. 753-760.
4. M. S. Weinberg and A. Kourepenis, "Error sources in in-plane silicon tuning-fork MEMS gyroscopes," J. Microelectromechanical Systems, vol. 15, no. 3, pp. 479-491, June 2006.
5. R. Dean, G. Flowers, A. S. Hodel, K. . MacAllister, R. Horvath, A. Matras, and R. Glover, "Vibration isolation of MEMS sensors for aerospace applications," in Proc. of the IMAPS International Conference and Exhibition on Advanced Packaging and Systems, March 10-13, 2002, pp. 166-170
6. J. A. Geen, "Very low cost gyroscopes," in Proc. IEEE Sensors, Irvine, CA, Oct 30-Nov 3, 2005, pp. 537-540.
7. F. N. Martin, Introduction to Audiology, 3rd Edition, Prentice-Hall, Inc., Engelwood Cliffs, N.J., 1986, pp. 29-34.
8. L. E. Kinsler, A. R. Frey, A. B. Coppens, and J. V. Sanders, Fundamentals of Acoustics, 3rd Edition, John Wiley & Sons, New York, 1982, pp. 298-302.
9. F. Miyara, "Sound levels." [Online]. Available: http://www.eie.fceia.unr.edu.ar/acustica/comite/soundlev.htm.
10. "±300°/s single chip yaw rate gyro with signal conditioning," Device Data Sheet: C03227-0-3/94(B), Analog Devices Inc., 2004.
11. "SiRRS01™ MEMS single-axis rate gyro," Device Data Sheet: 08.03.DS-G.001, BAE Systems, Inertial Products Division, 2003.
12. "QDARS," Device Data Sheet: 964485-1 Rev. D, Systron Donner Inertial.
13. "Ceramic Gyro," Device Data Sheet, NEC TOKIN Corp.
14. Tehrani, M. M., "Ring Laser Gyro Data Analysis with Cluster Sampling Technique," Proc. of the SPIE, Vol. 412, 1983, pp. 207-222.
15. Sargent, D., and Wyman, B. O., "Extraction of Stability Statistics from Integrated Rate Data", Proc. of the AIAA Guidance and Control Conference, Aug. 11-13, 1980.