Microstructure, thermo-physical and mechanical properties of spray-deposited Si-30Al alloy for electronic packaging application

Materials Characterization

Volumn 59, Issue 10, 2008, Pages 1455-1457

  Wang, Feng ^a   Xiong, Baiqing ^a   Zhang, Yongan ^a   Zhu, Baohong ^a   Liu, Hongwei ^a   Wei, Yanguang ^a  

^a GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS   (China)

Author keywords

Microstructure; Properties; Si 30Al alloy; Spray deposited

Indexed keywords

ALLOYS; ALUMINUM; BENDING TESTS; CARBON FIBER REINFORCED PLASTICS; ELECTRONICS PACKAGING; ERROR ANALYSIS; FLUID MECHANICS; HOT PRESSING; IMAGING TECHNIQUES; MECHANICAL PROPERTIES; MICROCRYSTALLINE SILICON; MICROSTRUCTURE; OPTICAL CONDUCTIVITY; OPTICAL MICROSCOPY; PESTICIDES; PHOTOMASKS; SILICON; SILICON ALLOYS; SPRAYING; THERMAL SPRAYING; THERMAL STRESS; THERMOELECTRICITY;

3-POINT BENDING; AL ALLOYS; COEFFICIENT OF THERMAL EXPANSION; DEPOSITION TECHNIQUES; ELECTRONIC PACKAGING; LOW COEFFICIENT OF THERMAL EXPANSION; MECHANICAL CHARACTERISTICS; OPTICAL-; PHYSICAL AND MECHANICAL PROPERTIES; PRIMARY SI; PROPERTIES; PROPERTY MEASUREMENTS; RICH PHASE; SI-30AL ALLOY; SPRAY ATOMIZATION; SPRAY-DEPOSITED;

THERMAL EXPANSION;

ALLOY; ATOMIZATION; BEND TESTS; BIOCIDES; DEPOSITION; ELECTRONICS; MICROSTRUCTURE; SPRAYING; THERMAL EXPANSION; THERMAL STRESS;

EID: 49949117406     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2008.01.012     Document Type: Article

References (8)

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