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Volumn 14, Issue 1, 1997, Pages 48-55
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Novel low expansion packages for electronics
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
AEROSPACE APPLICATIONS;
ELECTRONICS PACKAGING;
LIGHT WEIGHT STRUCTURES;
METALLIC MATRIX COMPOSITES;
MICROWAVE CIRCUITS;
SILICON CARBIDE;
ALUMINUM SILICON;
COPPER TUNGSTEN;
LOW EXPANSION ALLOYS;
ALUMINUM ALLOYS;
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EID: 0031378850
PISSN: 13670476
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (10)
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References (20)
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