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Volumn 157, Issue 3, 2000, Pages 36-39
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Spray-formed silicon-aluminum
a
a
NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
ELECTROPLATING;
THERMAL CONDUCTIVITY OF SOLIDS;
THERMAL EXPANSION;
SILICON-ALUMINUM ALLOYS;
SPRAY FORMING;
SILICON ALLOYS;
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EID: 0033882766
PISSN: 08827958
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (43)
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References (0)
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