A pressure sensor using flip-chip on low-cost flexible substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 750-754

  Xiao, G ^a   Chan, P C H ^a   Teng, A ^a   Cai, J ^a   Yuen, M M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; ELECTRIC VARIABLES MEASUREMENT; ELECTRONICS PACKAGING; ELECTROPLATING; MICROELECTROMECHANICAL DEVICES; PHOTOLITHOGRAPHY; PRESSURE MEASUREMENT; SCANNING ELECTRON MICROSCOPY; SENSORS; SOLDERING ALLOYS; SUBSTRATES;

ELECTRICAL TEST; EUTECTIC SOLDER BUMPS; FLEXIBLE SUBSTRATES; PRESSURE SENSOR; SCANNING ACOUSTIC MICROSCOPE; SOLDER BUMP FABRICATION;

FLIP CHIP DEVICES;

EID: 0034834928     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Low-cost flip-chip on board
2. Thermal management issues and evaluation of a novel, flexible substrate, 3-D packaging concept
3. Challenges in interconnection and packaging of microelectromechanical systems
4. The effect of Cu stud structure and eutectic solder electroplating on intermetallic growth and reliability of flip-chip solder bump
5. Study on failure mode of solder bump fabricated using eutectic solder electroplating process