Packaging of microsystems for harsh environments

IEEE Instrumentation and Measurement Magazine

Volumn 4, Issue 3, 2001, Pages 30-33

  Sparks, D R ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MICROMACHINING; SILICON SENSORS; SILICON WAFERS;

CERAMIC PACKAGE; MICROSYSTEMS; PRESSURE SENSORS;

ELECTRONICS PACKAGING;

EID: 0035450482     PISSN: 10946969     EISSN: None     Source Type: Journal    
DOI: 10.1109/5289.953456     Document Type: Article

References (2)

1. Applications of MEMS technology in automotive sensors and actuators
2. Flexible vacuum-packaging method for resonating micromachines