Investigations of development process of high hollow beveled microneedles using a combination of ICP RIE and dicing saw

Microsystem Technologies

Volumn 14, Issue 9-11, 2008, Pages 1475-1480

  Baron, N ^a   Passave, J ^a   Guichardaz, B ^a   Cabodevila, G ^a  

^a FEMTO ST INSTITUTE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

NONMETALS; SILICON;

DEVELOPMENT PROCESSES; ICP-RIE; INNER DIAMETER; LIVING CELLS; MICRO-NEEDLES; MICROMACHINED; OUT-OF PLANE; OUTER DIAMETER; SILICON MICRONEEDLES; SKIN PERMEABILITY; STRATUM CORNEUM;

ELECTRIC CURRENTS;

EID: 49949086956     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0596-1     Document Type: Conference Paper

References (10)

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