High-temperature mechanical behavior/microstructure correlation of Cu/Nb nanoscale multilayers

Materials Science and Engineering: A

Volumn 493, Issue 1-2, 2008, Pages 274-282

  Mara, N A ^a   Misra, A ^a   Hoagland, R G ^b   Sergueeva, A V ^c   Tamayo, T ^c   Dickerson, P ^b   Mukherjee, A K ^c  

^a CENTER FOR INTEGRATED NANOTECHNOLOGIES   (United States)

^b LOS ALAMOS NATIONAL LABORATORY   (United States)

^c University of California Davis   (United States)

Author keywords

High temperature deformation; Multilayers; Nanocomposite; Tension test

Indexed keywords

HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; STRAIN RATE; TENSILE STRENGTH; TENSILE TESTING;

HIGH TEMPERATURE DEFORMATION; HIGH TEMPERATURE MECHANICAL BEHAVIOR; HIGH-STRENGTH; LAYER THICKNESS; MICROSTRUCTURE CORRELATION; NANOSCALE MULTILAYERS; STRAIN-RATES; TEMPERATURE REGIONS; TENSION TESTS; TRUE STRAIN;

MULTILAYERS;

EID: 49849096260     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.08.089     Document Type: Article

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