Recent technologies and trends of power devices

Proceedings of the 14th International Workshop on the Physics of Semiconductor Devices, IWPSD

Volumn , Issue , 2007, Pages 787-792

  Majumdar, Gourab ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

IGBT; IPM; Power conversion and power module

Indexed keywords

APPLICATION FIELDS; FUTURE TECHNOLOGIES; IGBT; IPM; KEY TECHNOLOGIES; PACKAGING TECHNOLOGIES; POWER CONVERSION AND POWER MODULE; POWER CONVERSIONS; POWER DEVICES; POWER MODULES; POWER SEMI-CONDUCTOR;

ACTIVE FILTERS; CHIP SCALE PACKAGES; ELECTRIC CONDUCTIVITY; ELECTRONIC EQUIPMENT MANUFACTURE; NONMETALS; POWER ELECTRONICS; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICES; SEMICONDUCTOR MATERIALS; SEMICONDUCTOR SWITCHES; SILICON; SILICON CARBIDE; TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 49749129312     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IWPSD.2007.4472635     Document Type: Conference Paper

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