Nonorthogonal wafer dicing for waveguide, microelectromechanical systems, and nanotechnology applications

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 4, 2004, Pages

  Pau, S ^a   Taylor, J A ^a   Pai, C S ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYED WAVEGUIDE GRATING (AWG); MICROELECTROMECHANICAL SYSTEMS; NANOCHIPS; WAFER DICING;

CRYSTALLOGRAPHY; INDUCTIVELY COUPLED PLASMA; MICROELECTROMECHANICAL DEVICES; NANOTECHNOLOGY; PHOTOLITHOGRAPHY; PHOTORESISTS; REACTIVE ION ETCHING; SAWING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; THICKNESS MEASUREMENT; WAVEGUIDES;

WSI CIRCUITS;

EID: 4944255136     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1768184     Document Type: Article

References (6)

1. H. H. Gatzen, Microsyst. Technol. 7, 151 (2001).
2. W. L. Bishop, D. M. Summers, and A. W. Lichtenberger, IEEE Trans. Appl. Supercond. 11, 171 (2001).
3. P. McKinney, Solid State Technol. Suppl. (2001), p. 12.
4. S. A. McAuley, H. Ashraf, L. Atabo, A. Chambers, S. Hall, J. Hopkins, and G. Nicholls, J. Phys. D 34, 2769 (2001).
5. K. Ebe, H. Seno, and K. Horigome, J. Appl. Polym. Sci. 90, 436 (2003).
6. B. Ernst and M. C. Escher, Magic Mirror of M. C. Escher (Barnes and Noble Books, New York, 1996).