UV curable pressure-sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes

Journal of Applied Polymer Science

Volumn 90, Issue 2, 2003, Pages 436-441

  Ebe, Kazuyoshi ^a   Seno, Hideo ^a   Horigome, Katsuhiko ^a  

^a LINTEC CORPORATION   (Japan)

Author keywords

Adhesive deposit; Dicing tape; Pressure sensitive adhesives; Silicon wafer; UV curing

Indexed keywords

ADHESION; COMPOSITION; CROSSLINKING; CURING; ELASTIC MODULI; IRRADIATION; OLIGOMERS; SEMICONDUCTOR DEVICE MANUFACTURE; STRUCTURE (COMPOSITION); ULTRAVIOLET RADIATION;

BACKBONE STRUCTURE; CROSSLINKING DENSITY; DIACRYLOURETHANE OLIGOMER; PEELABLE DICING TAPES; PRESSURE SENSITIVE ADHESIVES; STORAGE MODULUS;

PLASTIC ADHESIVES;

POLYMER;

EID: 0042788761     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.12673     Document Type: Article

References (8)

1. Ebe, K.; Sasaki, T. J Appl Polym Sci 2003, 88, 1854.
2. Ebe, K.; Narita, H.; Taguchi, K.; Saito, T. Proceedings of the Conference on Radiation Curing Asia '88, Tokyo; 1988; p. 250.
3. Ebe, K.; Narita, H.; Taguchi, K.; Akeda, Y.; Saito, T. (to FSK Corp.), U.S. Pat. 4,756,986, 1988.
4. Koelling, J. H. Mater Eng 1981, 93(6), 68.
5. Bennet, R. E.; Hittner, M. A. (to Minnesota Mining & Manufacturing Co.), U.S. Pat. 4,286,047, 1981.
6. Ozawa T.; Ishiwata, S.; Kano, Y.; Kasemura, T. J Adhesion 2000, 72, 1.
7. Yukiyasu, K.; Urban, M. W. Proceedings of the 24th International Conference on Organic Coatings Waterborne, High Solids, Powder Coatings, Athens, July 6-10, 1998, p. 469-479
8. Yukiyasu, K.; Urban, M. W. Proceedings of 24th International Conference on Organic Coatings: Waterborne, High Solids, Powder Coatings, Athens, July 6-10, 1998, Institute of Materials Science: New Paltz, NY, 1998.