Stress relaxation during isothermal annealing in electroplated Cu films

Thin Solid Films

Volumn 516, Issue 21, 2008, Pages 7588-7594

  Hwang, Soo Jung ^a,b   Joo, Young Chang ^a   Koike, Junichi ^b  

^a Seoul National University   (South Korea)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Copper; Creep; Stress

Indexed keywords

ANNEALING; COPPER ALLOYS; COPPER PLATING; ELECTROCHEMISTRY; ELECTROPLATING; ISOTHERMAL ANNEALING; MOLECULAR BEAM EPITAXY; THICK FILMS;

CREEP; CU THIN FILMS; DEFORMATION MECHANISMS; ELECTROPLATED CU FILMS; STRESS; STRESS-RELAXATION;

COPPER;

EID: 49349113619     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.03.030     Document Type: Article

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