Enhancement of thermoelectric properties of sputtered Bi-Sb-Te thin films by electric current stressing

Applied Physics Letters

Volumn 93, Issue 4, 2008, Pages

  Liao, Chien Neng ^a   Liou, Kuen Ming ^a   Chu, Hsu Shen ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CARRIER CONCENTRATION; CARRIER MOBILITY; CONCENTRATION (PROCESS); ELECTRIC CONDUCTIVITY; ELECTRIC CURRENT MEASUREMENT; ELECTRIC CURRENTS; ELECTRIC POWER SUPPLIES TO APPARATUS; LIQUID PHASE EPITAXY; METALLIZING; PRECIPITATION (CHEMICAL); SEEBECK COEFFICIENT; THERMOELECTRIC EQUIPMENT; THICK FILMS; TRANSPORT PROPERTIES;

BI-SB-TE; ELECTRIC CURRENT STRESSING; ELECTRICAL CONDUCTIVITY; ELECTRICAL TRANSPORT PROPERTIES; HIGH-DENSITY; RICH PHASE; THIN FILMS;

BISMUTH PLATING;

EID: 49149088426     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2965487     Document Type: Article

References (17)

1. H. Boettner, J. Nurnus, A. Gavrikov, G. Kuehner, M. Jaegle, C. Kuenzel, D. Eberhard, G. Plescher, A. Schubert, and K. H. Schlereth, J. Microelectromech. Syst. 13, 414 (2004).
2. G. E. Bulman, E. Siivola, B. Shen, and R. Venkatasubramanlan, Appl. Phys. Lett. 89, 122117 (2006).
3. D. M. Rowe, Mar. Technol. Soc. J. 27, 43 (1993).
4. D. H. Kim, G. H. Lee, and O. J. Kim, Semicond. Sci. Technol. 22, 132 (2007).
5. A. Giani, A. Boulouz, F. Pascal-Delannoy, A. Foucaran, E. Charles, and A. Boyer, Mater. Sci. Eng., B 64, 19 (1999).
6. J. R. Lin, J. F. Whitacre, J. P. Fleurial, C. K. Huang, M. A. Ryan, and N. V. Myung, Adv. Mater. (Weinheim, Ger.) 17, 1488 (2005).
7. M. M. Wakkad, J. Phys. Chem. Solids 51, 1171 (1990).
8. M. Omori, Mater. Sci. Eng., A 287, 183 (2000).
9. J. Jiang, L. Chen, S. Bai, and Q. Yao, J. Alloys Compd. 390, 208 (2005).
10. X. L. Wang, J. D. Guo, Y. M. Wang, X. Y. Wu, and B. Q. Wang, Appl. Phys. Lett. 89, 061910 (2006).
11. C. N. Liao, T. H. She, P. J. Liao, and H. S. Chu, J. Electrochem. Soc. 154, 304 (2007).
12. Z. Stary, J. Horak, M. Stordeur, and M. Stolzer, J. Phys. Chem. Solids 49, 29 (1988).
13. B. Poudel, Q. Hao, Y. Ma, Y. Lan, A. Minnich, B. Yu, X. Yan, D. Wang, A. Muto, D. Vashaee, X. Chen, J. Liu, M. S. Dresselhaus, G. Chen, and Z. Ren, Science 320, 634 (2008).
14. H. M. Gilder and D. Lazarus, Phys. Rev. 145, 507 (1966).
15. G. S. Nolas, J. Sharp, and H. J. Goldsmid, Thermoelectrics: Basic Principles and New Materials Developments (Springer, Berlin, 2001), Chap..
16. M. Stordeur, M. Stolzer, H. Sobotta, and V. Riede, Phys. Status Solidi B 150, 165 (1988).
17. J. P. Fleurial, L. Gailliard, and R. Triboulet, J. Phys. Chem. Solids 49, 1249 (1988).