Observation of twin boundary migration in copper during deformation

Materials Science and Engineering: A

Volumn 372, Issue 1-2, 2004, Pages 173-179

  Field, D P ^a   True, B W ^a   Lillo, T M ^b   Flinn, J E ^c  

^a WASHINGTON STATE UNIVERSITY   (United States)

^b IDAHO NATIONAL LABORATORY   (United States)

^c UNIVERSITY OF IDAHO   (United States)

Author keywords

Copper; Deformation; Electron backscatter diffraction (EBSD); Twin boundaries

Indexed keywords

ANNEALING; DISLOCATIONS (CRYSTALS); METAL INSULATOR BOUNDARIES; PLASTIC DEFORMATION; PLASTIC FLOW;

CHANNEL DIE DEFORMATION; DISLOCATION SOURCES; INTERMITTENT ORIENTATION IMAGING; TWIN BOUNDARY MIGRATION;

COPPER;

COPPER;

EID: 2142646520     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.12.044     Document Type: Article

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