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Applied Physics A: Materials Science and Processing

Volumn 92, Issue 3, 2008, Pages 693-701

Physical characteristics of polyimide films for flexible sensors

(3) Chang, Wen Yang a,b Fang, Te Hua c Lin, Yu Cheng a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Taiwan)

c NATIONAL FORMOSA UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); BENDING MOMENTS; DETECTORS; ELASTICITY; ENERGY DISSIPATION; NANOINDENTATION; OPTICAL DESIGN; OPTICAL SENSORS; POLYMERS; SENSORS; STRESS-STRAIN CURVES; STRESSES; TENSILE TESTING; THERMAL EXPANSION; THERMAL SPRAYING; UNLOADING;

ELASTIC ENERGIES; FLEXIBLE SENSORS; LOAD-UNLOAD; MECHANICAL CHARACTERISTICS; NANOINDENTATION TESTING; NEAR-IR; OPTICAL (PET) (OPET); PHYSICAL CHARACTERISTICS; POLY-IMIDE FILMS; STRESS STRAIN (IGC:D6/ E13); ULTRAVIOLET (UV) LIGHT; UNIFORM HARDNESS; YOUNG'S MODULUS (IGC: E14/K14);

MOLECULAR BEAM EPITAXY;

EID: 48349112650 PISSN: 09478396 EISSN: 14320630 Source Type: Journal
DOI: 10.1007/s00339-008-4623-y Document Type: Conference Paper

Times cited : (59)

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