Thermal-aware incremental floorplanning for 3D ICs

ASICON 2007 - 2007 7th International Conference on ASIC Proceeding

Volumn , Issue , 2007, Pages 1092-1095

  Li, Xin ^a   Yuchun, Ma ^a   Hong, Xianlong ^a   Dong, Sheqin ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRONICS INDUSTRY; EMBEDDED SYSTEMS; INTEGRATED CIRCUITS; LINEAR PROGRAMMING; LINEARIZATION; THREE DIMENSIONAL; VLSI CIRCUITS;

3-D ICS; ANALYTICAL APPROACHES; CHIP AREAS; FLOOR-PLANNING; FLOORPLANS; HEAT DISSIPATION; INTERCONNECT DELAYS; INTERNATIONAL CONFERENCES; MIXED-INTEGER LINEAR PROGRAMMING; ON-CHIP TEMPERATURE; ONE WAY; THREE DIMENSIONAL INTEGRATED CIRCUITS; TOTAL WIRE LENGTH; VLSI DESIGNS; WIRE LENGTHS;

INTEGER PROGRAMMING;

EID: 48349103757     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICASIC.2007.4415823     Document Type: Conference Paper

References (11)

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