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1
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0034827496
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The future of electronics in automobiles
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Osaka, Japon, May
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J. G. Kassakian and D. J. Perreault, "The future of electronics in automobiles," in Proceedings of the ISPSD'2001 Conference, Osaka, Japon, May 2001, pp. 15-19.
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(2001)
Proceedings of the ISPSD'2001 Conference
, pp. 15-19
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Kassakian, J.G.1
Perreault, D.J.2
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2
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0034472251
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Thermal fatigue resistance evaluation of solder joints in ICBT power modules for traction applications, Thebaud, J.-M.; Woirgard, E.; Zardini, C.; Sommer, K.-H., Power Electronics Specialists Conference, 2000. PESC 00, 3, 18-23 June 2000 Page(s):1285 - 1290 3
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Thermal fatigue resistance evaluation of solder joints in ICBT power modules for traction applications, Thebaud, J.-M.; Woirgard, E.; Zardini, C.; Sommer, K.-H., Power Electronics Specialists Conference, 2000. PESC 00, Volume 3, 18-23 June 2000 Page(s):1285 - 1290 vol.3
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3
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24644494367
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Three-Dimensional Packaging for Power Semiconductor Devices and Modules, Calata, J.N.; Bai, J.G
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Aug, Pages
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Three-Dimensional Packaging for Power Semiconductor Devices and Modules, Calata, J.N.; Bai, J.G.; Xingsheng Liu; Sihua Wen; Guo-Quan Lu. IEEE Transactions on Advanced Packaging. Volume 28. Issue 3, Aug. 2005 Page(s):404-412
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(2005)
Xingsheng Liu; Sihua Wen; Guo-Quan Lu. IEEE Transactions on Advanced Packaging
, vol.28
, Issue.3
, pp. 404-412
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4
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29444433099
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Silicon carbide and diamond for high temperature device applications
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Jan, DOI: 10.1007/s 10854-005-5137-4
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Silicon carbide and diamond for high temperature device applications, Magnus Willander: Milan Friesel; Qumar-ul Wahab and Boris Straumal, Journal of Materials Science: Materials in Electronics, vol 17, number 1, pp 1 - 25, Jan. 2006, DOI: 10.1007/s 10854-005-5137-4, http://www. springerlink.com/content/y50733755h321743
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(2006)
Magnus Willander: Milan Friesel; Qumar-ul Wahab and Boris Straumal, Journal of Materials Science: Materials in Electronics
, vol.17
, Issue.1
, pp. 1-25
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5
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85176706857
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Piezoelectric properties and elastic constants of 4H and 6H SiC at temperatures 4-320K, S. Karmann; R. Helbig, R.A. Stein, J. Appl. Phys. 66 (8), Oct 1989, American Institute of Physics, pp 3922 - 3924
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Piezoelectric properties and elastic constants of 4H and 6H SiC at temperatures 4-320K, S. Karmann; R. Helbig, R.A. Stein, J. Appl. Phys. 66 (8), Oct 1989, American Institute of Physics, pp 3922 - 3924
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6
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22544474579
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William W. Sheng and Ronald P. Colino, CRC Press, Boca Raton, Florida, 273p, ISBN: 0-8493-2260-X
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Power Electronic Modules: Design and Manufacture. William W. Sheng and Ronald P. Colino, CRC Press 2005, Boca Raton, Florida, 273p, ISBN: 0-8493-2260-X
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(2005)
Power Electronic Modules: Design and Manufacture
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7
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48349147589
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datasheet from International Rectifier, available online
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IR2214 Half-bridge gute driver IC, datasheet from International Rectifier, available online: http://www.irf.com/product-info/datasheets/data/ ir2114ss.pdf
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IR2214 Half-bridge gute driver IC
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8
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0035694761
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Double-sided cooling for high power ICBT modules using flip chip technology, Gillot, C.; Schaeffer, C.; Massit, C.; Meysenc, L., IEEE Transactions on Components and Packaging Technologies, 24, Issue 4, Dec. 2001 Page(s):698 - 704
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Double-sided cooling for high power ICBT modules using flip chip technology, Gillot, C.; Schaeffer, C.; Massit, C.; Meysenc, L., IEEE Transactions on Components and Packaging Technologies, Volume 24, Issue 4, Dec. 2001 Page(s):698 - 704
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9
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48349105607
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Cooling jets. Chambers, Andrew; Dailey, Geoffrey; David R. H; Ireland, Peter; patent, US application number 20050074325. 22 sep 2004, available online at http://appft1.uspto.gov/netahtml/PTO/search-bool.html
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Cooling jets. Chambers, Andrew; Dailey, Geoffrey; David R. H; Ireland, Peter; patent, US application number 20050074325. 22 sep 2004, available online at http://appft1.uspto.gov/netahtml/PTO/search-bool.html
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10
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48349135410
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Compact Double-Side Liauid-Impingement-Cooled Integrated Power Electronic Module, C. M. Johnson; C. Buttay; S. J. Rashid; F. Udrea; G. A. J. Amaratunga; P. Ireland and R. K. Malhan, Proceedings of ISPSD'07, May 2007, Keju, Korea.
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Compact Double-Side Liauid-Impingement-Cooled Integrated Power Electronic Module, C. M. Johnson; C. Buttay; S. J. Rashid; F. Udrea; G. A. J. Amaratunga; P. Ireland and R. K. Malhan, Proceedings of ISPSD'07, May 2007, Keju, Korea.
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11
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48349144342
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datasheet from International Rectifier, available online
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GB15RFI20K, ICBT PIM module, datasheet from International Rectifier, available online: http://www.irf.com/product-info/datasheets/data/ gbl5rf120k.pdf
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GB15RFI20K, ICBT PIM module
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12
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48349131822
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datasheet from ACC Silicones, available online
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AS1623, High Temperature, Neutral Cure, Flowable Sealant, datasheet from ACC Silicones, available online: http://www.acc-silicones.com/ docView.php?pdffilename=AS1623%20TDS%2008-2006.pdf
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AS1623, High Temperature, Neutral Cure, Flowable Sealant
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