EMI suppression and switching noise mitigation in packages and boards using electromagnetic band gap structures

Conference Proceedings of the International Symposium on Signals, Systems and Electronics

Volumn , Issue , 2007, Pages 271-274

  Ramahi, O M ^a   Mohajer Iravani, B ^b   Qin, J ^c   Shahparnia, S ^d   Kamgaing, T ^e  

^a UNIVERSITY OF WATERLOO   (Canada)

^b UNIVERSITY OF MARYLAND   (United States)

^c Kawasak Rail Car Inc   (United States)

^d ST JUDE MEDICAL   (United States)

^e INTEL CORPORATION   (United States)

Author keywords

Electromagnetic interference; Signal integrity; Switching noise

Indexed keywords

ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC PULSE; ELECTROMAGNETISM; ELECTRONIC EQUIPMENT MANUFACTURE; ENERGY GAP; GALLIUM ALLOYS; MAGNETIC MATERIALS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SIGNAL PROCESSING;

CIRCUIT BOARDS; ELECTRO-MAGNETIC INTERFERENCE (EMI); ELECTROMAGNETIC BAND GAP (EBG) STRUCTURES; ELECTROMAGNETIC BAND GAP STRUCTURES (EBG); EYE DIAGRAMS; IN-CHIP; INTERNATIONAL SYMPOSIUM; PRACTICAL IMPLEMENTATION; SIGNAL-INTEGRITY (SI); SPECIAL EMPHASIS; SWITCHING NOISE;

DIELECTRIC MATERIALS;

EID: 47349093717     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSSE.2007.4294465     Document Type: Conference Paper

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