SCOPUS 정보 검색 플랫폼

Journal of the Electrochemical Society

Volumn 155, Issue 8, 2008, Pages

Monitoring cuprous ion transport by scanning electrochemical microscopy during the course of copper electrodeposition

(3) O'Mullane, Anthony P a,c Neufeld, Aaron K b Bond, Alan M a

a MONASH UNIVERSITY (Australia)

b Sales Marketing Innovation and Technology (Australia)

c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTIC EQUIPMENT; COPPER; COPPER ALLOYS; DENSITY (SPECIFIC GRAVITY); DOPING (ADDITIVES); ELECTROPLATING; IONS; METALLIZING; METALS; MICROSCOPIC EXAMINATION; REDUCTION; SCANNING; SCANNING ELECTRON MICROSCOPY; SCANNING PROBE MICROSCOPY; SOLUTIONS;

(E ,3E) PROCESS; AQUEOUS SOLUTIONS; CLOSE PROXIMITY; COPPER ELECTRODEPOSITION; ELECTROCHEMICAL SOCIETY (ECS); IN SITU STUDIES; ION TRANSPORTS; METAL ELECTRODEPOSITION; PLATING BATHS; QUALITATIVE ASPECTS; ROTATING RING-DISK ELECTRODE (RRDE) TECHNIQUE; SCANNING ELECTROCHEMICAL MICROSCOPY (SECM); TC MODE;

ELECTRODEPOSITION;

EID: 46649101368 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.2936177 Document Type: Article

Times cited : (15)

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