Materials science: High-frequency chip connections

Science

Volumn 320, Issue 5877, 2008, Pages 756-757

  Spencer, Todd J ^a   Osborn, Tyler ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER;

ELECTRICITY; ELECTRONIC EQUIPMENT; VELOCITY;

COMPUTER ANALYSIS; ELECTRIC CONDUCTIVITY; ELECTRONICS; MICROPROCESSOR; PRIORITY JOURNAL; SHORT SURVEY; SIGNAL PROCESSING;

EID: 46649089182     PISSN: 00368075     EISSN: 10959203     Source Type: Journal    
DOI: 10.1126/science.1157129     Document Type: Short Survey

References (9)

1. International Technology Roadmap for Semiconductors, 2007 (www.itrs.net).
2. H. Cho, K. H. Koo, P. Kapur, K. C. Saraswat, IEEE Electron Device Lett. 29, 122 (2008).
3. T. H. Kim, M. M. Howlader, T. Itoh, T. Suga, J. Vac. Sci. Technol. A 21, 44 (2003).
4. T. Osborn, A. He, N. Galiba, P. A. Kohl, J. Electrochem. Soc. 155, D308 (2008).
5. T. J. Spencer, P. J. Joseph, T. H. Kim, M. Swaminathan, P. A. Kohl, IEEE Trans. Microwave Theory Tech. 55, 1919 (2007).
6. T. K. Gaylord, Y.-J. Chang, Appl. Opt. 46, 6476 (2007).
7. B. Li, T. D. Sullivan, T. C. Lee, D. Badami, Microelectron. Reliabil. 44, 365 (2004).
8. Z.-S. Choi, R. Monig, C. V. Thompson, J. Appl. Phys. 102, 083509 (2007).
9. Supported by the Semiconductor Research Corporation through the Focus Center Research Program (Interconnect Focus Center) and GRC programs.