Analytical model of power/ground noise coupling to signal traces in high-speed multi-layer packages or boards

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 45-50

  Kim, Jingook ^a   Rotaru, M D ^b   Lee, Junwoo ^a   Park, Jongbae ^a   Alexander, P ^b   Iyer, M K ^b   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL MODELS; ELECTRONICS PACKAGING;

COUPLING MODELING; GOOD CORRELATIONS; MULTI-LAYER SYSTEM; NOISE COUPLING; NOISE VOLTAGE; SIGNAL TRACES; SWITCHING CURRENTS; TRANSFER IMPEDANCE;

TRANSIENT ANALYSIS;

EID: 84954073469     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271488     Document Type: Conference Paper

References (11)

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