Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1589-1593

  Lee, Junwoo ^a   Seng, Yeo Mui ^b   Rotaru, Mihai Dragos ^b   Iyer, Mahadevan K ^b   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELECTRIC FIELDS; ELECTRIC POTENTIAL; MAGNETIC FIELDS; MAGNETIC PERMEABILITY; PERMITTIVITY; RESONANCE; SKIN EFFECT; SYSTEMS ANALYSIS;

HIGH-FREQUENCY PLANE-TO-PLANE COUPLING; MULTI-LAYER PACKAGES;

ELECTRONICS PACKAGING;

EID: 0038688708     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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