Electrical behavior of decoupling capacitors embedded in multilayered PCBs

IEEE Transactions on Electromagnetic Compatibility

Volumn 43, Issue 4, 2001, Pages 549-556

  Madou, An ^b   Martens, Luc ^a,b  

^a IEEE   (Belgium)

^b GHENT UNIVERSITY   (Belgium)

Author keywords

Capacitors; Modeling; Printed circuits

Indexed keywords

DECOUPLING CAPACITORS;

ELECTRIC PROPERTIES; FREQUENCIES; LAMINATES; MATHEMATICAL MODELS; MULTILAYERS; PRINTED CIRCUIT BOARDS;

CAPACITORS;

EID: 0035519376     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/15.974634     Document Type: Article

References (8)

1. Future trends toward integral passives
2. Integrated integral passive components: A technology roadmap
3. Design considerations for using integrated passive components
4. Reliability of flexible thin film resistors and electrical characterization of thin film embedded capacitors and inductors
5. Measurement set-up for high-frequency characterization of planar contact devices
6. Conversion of S, Z, Y, h, ABCD, and T parameters which are valid for complex source and load impedances