Low-cost and low-electromagnetic-interference packaging of optical transceiver modules

Journal of Lightwave Technology

Volumn 22, Issue 9, 2004, Pages 2177-2183

  Cheng, Wood Hi ^a   Hung, Wen Chi ^a   Lee, Chien Hui ^a   Hwang, Gan Lin ^b   Jou, Wern Shiang ^c   Wu, Tzong Lin ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c University of Wisconsin Madison   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; ELECTROMAGNETIC SHIELDING; ELECTRONICS PACKAGING; LIGHT INTERFERENCE; LIGHT TRANSMISSION; LIQUID CRYSTAL POLYMERS; NONMETALLIC MATRIX COMPOSITES; NYLON POLYMERS; OPTICAL COMMUNICATION; TRANSCEIVERS;

CARBON FILLER COMPOSITES; NANOSCALE HOLLOW CARBON NANOCAPSULES EPOXY COMPOSITES; OPTICAL TRANSCEIVER MODULES; PLASTIC COMPOSITE; PLASTIC PACKAGES; SHIELDING EFFECTIVENESS; WOVEN CONTINUOUS CARBON FILLER;

OPTICAL COMMUNICATION EQUIPMENT;

EID: 4644236052     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/JLT.2004.833250     Document Type: Article

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