A novel method of removing polyimide sacrificial layer

Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS

Volumn , Issue , 2006, Pages 209-212

  Guo, Xinglong ^a   Cai, Miao ^a   Liu, Lei ^a   Lai, Zongsheng ^a   Zhu, Shouzheng ^a  

^a EAST CHINA NORMAL UNIVERSITY   (China)

Author keywords

Cure; Etch; MEMS; Polyimide

Indexed keywords

COMPOSITE MICROMECHANICS; INTELLECTUAL PROPERTY; MICROELECTROMECHANICAL DEVICES; MOLECULES; NEMS; POLYMERS;

INTERNATIONAL CONFERENCES; MEMS SWITCHES; MOLECULAR SYSTEMS; NOVEL METHODS; POLYIMIDE SACRIFICIAL LAYER; PROPERTY (S); TRADE SECRETS;

MEMS;

EID: 46149104149     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEMS.2006.334688     Document Type: Conference Paper

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