Suppression of stiction in MEMS

Materials Research Society Symposium - Proceedings

Volumn 605, Issue , 2000, Pages 105-116

  Mastrangelo, C H ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CANTILEVER BEAMS; CAPILLARITY; ELASTICITY; FAILURE (MECHANICAL); MICROMACHINING; MICROSTRUCTURE; POLYSILICON; STICTION; STIFFNESS; SURFACE TREATMENT; YIELD STRESS;

MECHANICAL COLLAPSE; STICTION FAILURE;

MICROELECTROMECHANICAL DEVICES;

EID: 0034504648     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (56)

1. C. H. Mastrangelo, "Adhesion related failure mechanisms in microelectromechanical systems," Trib. Lett., vol. 3, pp. 223-238, 1997.
2. K. Chau, C. Fung, P. R. Harris, and G. Dahrooge, "A verslile polysilicon diaphragm pressure sensor chip," in Int. Electron Devices Meeting, (IEDM 91), pp. 695-697, 1991.
3. D. W. Burns, Micromechanics of Integrated Sensors and the Planar Processed Pressure Transducer. PhD thesis, University of Winsconsin, Madison, 1988.
4. J. M. Lysko, E. Stolarski, and R. S. Jachowicz, "Capacitive silicon pressure sensor based on the one-side wafer processing," in Transducers' 91, pp. 685-688, 1991.
5. I. T. Kung and H.-S. Lee, "An integrated air-gap capacitor process for sensor applications," in Transducers' 91, pp. 312-314, 1991.
6. W. Yun, R. T. Howe, and P. R. Gray, "Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry," in International Workshop on Solid-State Sensors and Actuators (Hilton Head' 92), pp. 126-131, 1992.
7. L. Ristic, R. Gutteridge, B. Dunn, D. Mietus, and P. Bennett, "Surface micromachined polysilicon accelerometer," in International Workshop on Solid-State Sensors and Actuators (Hilton Head' 92), pp. 118-121, 1992.
8. H. C. Nathanson and J. Guldberg, "Topologically structured thin films in semiconductor device operation," Physics of Thin Films, vol. 8, pp. 251-298, 1975.
9. H. Guckel and D. W. Burns, "Fabrication of micromechanical devices from polysilicon films with smooth surfaces," Sensors and Actuators, vol. 20, pp. 117-122, 1989.
10. J. N. Israelachvili, Intemolecular and Surface Forces. New York: Academic Press. 1985.
11. M. R de Boer, P. J. Clews, B. K. Smith, and T. A. Michalske, "Adhesion of polysilicon microbeams in controlled humidity ambients," in Mat. Res. Soc. Symp. Proc., Vol. 518, pp. 131-136, 1995.
12. C. H. Mastrangelo and C. H. Hsu, "Mechanical stability and adhesion of microstructures under capillary forces- parts I and II," Journal of Microelectromechanical Systems, vol. 2, pp. 33-55, 1993.
13. C. H. Mastrangelo and C. H. Hsu, "A simple experimental technique for the measurement of the work of adhesion of microstructures," in International Workshop on Solid-State Sensors and Actuators (Hilton Head' 92), pp. 208-212, 1992.
14. E. W. Flosdorf, Freeze Drying: Drying by Sublimation. Ann Arbor, MI: University Microfilms International, 1982.
15. R. O. Holler, Freeze-Drying Biological Specimens. Washington, DC: Smithsonian Institution Press, 1979.
16. I. D. Mellor, Fundamentals of Freeze Drying. New York: Academic Press, 1978.
17. N. Takeshima, K. J. Gabriel, M. Ozaki, J. Takashashi, H. Horiguchi, and H. Fujita, "Electrostatic parallelogram actuators," in Transducers' 91, pp. 63-66, 1991.
18. G. T. Mulhern, D. Soane, and R. T. Howe, "Supercritical carbon dioxide drying for microstructures," in Transducers' 93, pp. 296-299, 1993.
19. C. J. Dawes, Introduction to Biological Electron Microscopy: Theory and Techniques. Burlington, VT: Ladd Research Industries, 1988.
20. H. Watanabe, S. Ohnishi, I. Honma, H. Kitajima, H. Ono, R. Wilhelm, and A. Sophie, "Selective etching of phosphosilicate glass with low pressure vapor hf," J. Electrochem. Soc., vol. 142, pp. 237-243, 1995.
21. M. Wong, M. Moslehi, and R. Bowling, "Wafer temperature dependence of the vapor-phase hf oxide etch," J. Electrochem. Soc., vol. 140. pp. 205-208, 1993.
22. 3OH gas mixture at elevated temperature," J. Electrochem. Soc., vol. 140, pp. p. L64-L66, 1993.
23. T. Hirano, T. Furuhata, and H. Fujita, "Dry releasing of electroplated rotational and overhanging structures," in International Conference on Micro Electromechanical Systems (MEMS 93), Fort Lauderdale, FL, U.S.A. Feb. 1993, pp. 278-283.
24. C. Mastrangelo and G. Saloka, "A dry-release method based on polymer columns for microstructure fabrication," Proc. IEEE Micro Electro Mech. Syst. Workshop, Fort Lauderdale, FL, U.S.A. Feb. 1993, pp. 77-81.
25. M. Orpana and A. O. Korhonen, "Control of residual stress of polysilicon thin films by heavy doping in surface micromachining," in Transducers' 91, pp. 957-960, 1991.
26. F. Kozlowski, N. Lindmair, T. Scheiter, C. Hierold, and W. Lang, "A novel method to avoid sticking of surface micromachined structures," Transducers'95, pp. 220-223, 1995.
27. H. V. Jansen, J. G. E. Gardeniers, J. Elders, H. A. C. Tilmans, and M. Elwenspoek, "Applications of fluorocarbon polymers in micromechanics and micromachining," Sensors and Actuators, vol. A41-42, pp. 136-140, 1994.
28. T. Abe, W. C. Messner, and M. Reed, "Effective methods to prevent stiction during post-release-etch processing," Proc. IEEE Micro Electro Mech. Syst. Workshop, Amsterdam, Neth, Feb. 1995, pp. 94-99.
29. G. Gould and E. A. Irene, "An in-situ study of aqueous HF treatment of silicon by contact angle measurement and ellipsometry," J. Electrochem. Soc., vol. 135, pp. 1535-1539, 1988.
30. 2 by water," Applied Physics Letters, vol. 25, pp. 531-532, 1974.
31. 2 surfaces by contact angle measurements," J. Electrochem. Soc., vol. 121, pp. 669-672, 1974.
32. K. Hermansson, U. Lindberg, B. Hök, and G. Palmskog, "Wetting properties of silicon surfaces," in Transducers' 91, pp. 193-196, 1991.
33. D. Graf, M. Grunder, R. Schulz, and L. Muhlhoff, "Oxidation of hf-treated si wafer surfaces in air," J. Applied Phys., vol. 68, pp. 5155-5161, 1990.
34. H. Watanabe, M. Hamano, and M. Harazono, "The role of atmospheric oxygen and water in the generation of water marks on the silicon surface in cleaning processes," Mat. Sci. Eng., vol. B4, pp. 401-405, 1989.
35. M. Morita, T. Ohmi, E. Hagesawa, M. Kawakami, and K. Suma, "Control factor of native oxide growth on silicon in air or in ultrapure water," Applied Physics Letters, vol. 55, pp. 562-564, 1989.
36. A. Ulman, An Introduction to Ultrathin Organic Films: From Langmuir-Blodgett to Self-Assembly. Boston: Academic Press, 1991.
37. R. Alley, R. T. Howe, and K. Komvopoulos, "The effect of release-etch processing on surface microstructure stiction," in International Workshop on Solid-State Sensors and Actuators (Hilton Head' 92), pp. 202-207, 1992.
38. M. Houston, R. Maboudian, and R. T. Howe, "Self-assembled monolayer films as durable anti-stiction coatings for polysilicon microstructures," in International Workshop on Solid-State Sensors and Actuators (Hilton Head' 96), pp. 42-47, 1996.
39. U. Srinivasan, M. R. Houston, R. T. Howe, and R. Maboudian, "Self-assembled fluorocarbon films for enhanced stiction reduction," in Transducers' 97, pp. 1399-1402, 1997.
40. B. P. Gogoi and C. H. Mastrangelo, "Adhesion release and yield enhancement of microstructures using pulsed lorentz forces," Journal of Microelectromechanical Systems, vol. 4, pp. 185-192, 1995.
41. V. Kaajakari and A. Lal, "Pulsed ultrasonic release and assembly of micromachines," in Transducers' 99, pp. 212-215, 1999.
42. R. L. Alley, P. Mai, K. Komvopulos, and R. T. Howe, "Surface roughness modification of interfacial contacts in polysilicon microstructures," in Transducers' 93, pp. 288-291, 1993.
43. Y. Yee, K. Chun, and J. D. Lee, "Polysilicon surface modification technique to reduce sticking of microstructures," in Transducers' 95, pp. 206-209, 1995.
44. L.-S. Fan, Integrated Micromachinery - Moving Structures in Silicon Chips. PhD thesis, University of California, Berkeley, 1990.
45. W. C. Tang, T.-C. H. Nguyen, and R. T. Howe, "Laterally driven polysilicon resonant microstructures," Proc. IEEE Micro Electro Mech. Syst. Workshop. Salt Lake City, Utah, U.S.A., Feb. 1989, pp. 53-59.
46. K. L. Johnson, K. Kendall, and A. D. Roberts, "Surface energy and the contact of elastic solids," Proc. Royal Soc. London A, vol. 324, pp. 301-313, 1971.
47. K. L. Johnson, Contact Mechanics. New York: Cambridge University Press, 1987.
48. M. R. Houston, R. Maboudian, and R. T. Howe, "Ammonium fluoride anti-stiction treatments for polysilicon microstructures," Transducers'95, pp. 210-213, 1995.
49. L. J. Hornbeck, "Digital light processing and MEMS: timely convergence for a bright future," in Proc. SPIE Micromachining and Microfabrication Process Technology Conference, vol. SPIE 2639, pp. 1-21, 1995.
50. J. J. Licari, Plastic Coatings for Electronics. New York: McGraw-Hill, 1970.
51. H. Yasuda and T. Hsu, "Some aspects of plasma polymerization of fluorine containing organic compounds," J. Polym. Sci. Polym Chem. Ed., vol. 15, pp. 2411-2424, 1977.
52. H. Yasuda and T. Hsu, "Some aspects of plasma polymerization of fluorine containing organic compounds, ii. comparison of emylene and tetrafluoroethylene," J. Polymer Sci., vol. 16, pp. 415-425, 1978.
53. H. Yasuda, Plasma Polymerization. New York: Academic Press, 1985.
54. P. D. Buzzard, Plasma Polymerization of Tetrafluoroethylene in a Field Free Zone. PhD thesis, University of California, Berkeley, 1978.
55. P. F. Man, B. P. Gogoi, and C. H. Mastrangelo, "Elimination of post-release adhesion in microstructures using thin conformal fluorocarbon films," Proc. IEEE Micro Electro Mech. Syst. Workshop, San Diego, CA, U.S.A. Feb. 1996, pp. 55-60.
56. P. F. Man, B. P. Gogoi, and C. H. Mastrangelo, "Elimination of post-release adhesion in microstructures using conformal fluorocarbon films," Journal of Microelectromechanical Systems, vol. 6, pp. i25-34, March 1997.