-
1
-
-
0030288186
-
Plasma immersion ion implantation - A fledgling technique for semiconductor processing
-
Nov
-
P. K. Chu, S. Qin, C. Chan, N. W. Cheung, and L. A. Larson, "Plasma immersion ion implantation - A fledgling technique for semiconductor processing," Mater. Sci. Eng., R Rep., R17, no. 6, pp. 207-280, Nov. 1996.
-
(1996)
Mater. Sci. Eng., R Rep
, vol.R17
, Issue.6
, pp. 207-280
-
-
Chu, P.K.1
Qin, S.2
Chan, C.3
Cheung, N.W.4
Larson, L.A.5
-
2
-
-
45949104329
-
-
M. I. Current, N. W. Cheung, S. B. Felch, B. Mizuno, C. Chan, and K. C. Walter, Plasma immersion ion implantation: Applications for semiconductor materials and coatings, in Ion Implantation Science and Technology, J. F. Ziegler, Ed., 2000 ed. Edgewater, MD: Ion Implantation Technology Co., 2000, pp. 133-171.
-
M. I. Current, N. W. Cheung, S. B. Felch, B. Mizuno, C. Chan, and K. C. Walter, "Plasma immersion ion implantation: Applications for semiconductor materials and coatings," in Ion Implantation Science and Technology, J. F. Ziegler, Ed., 2000 ed. Edgewater, MD: Ion Implantation Technology Co., 2000, pp. 133-171.
-
-
-
-
3
-
-
0031072421
-
Plasma doping dosimetry
-
Feb
-
E. C. Jones and N. W. Cheung, "Plasma doping dosimetry," IEEE Trans. Plasma Sci., vol. 25, no. 1, pp. 42-52, Feb. 1997.
-
(1997)
IEEE Trans. Plasma Sci
, vol.25
, Issue.1
, pp. 42-52
-
-
Jones, E.C.1
Cheung, N.W.2
-
4
-
-
4043180062
-
Dynamic sheath model of collisionless multi-species plasma immersion ion implantation
-
Jul. 1
-
S. Qin, Z. Jin, and C. Chan, "Dynamic sheath model of collisionless multi-species plasma immersion ion implantation," J. Appl. Phys., vol. 78, no. 1, pp. 55-60, Jul. 1, 1995.
-
(1995)
J. Appl. Phys
, vol.78
, Issue.1
, pp. 55-60
-
-
Qin, S.1
Jin, Z.2
Chan, C.3
-
5
-
-
0037525421
-
Faraday dosimetry characteristics of PIII doping processes
-
Jun
-
S. Qin, M. P. Bradley, and F. L. Kellerman, "Faraday dosimetry characteristics of PIII doping processes," IEEE Trans. Plasma Sci. vol. 31, no. 3, pp. 369-376, Jun. 2003.
-
(2003)
IEEE Trans. Plasma Sci
, vol.31
, Issue.3
, pp. 369-376
-
-
Qin, S.1
Bradley, M.P.2
Kellerman, F.L.3
-
6
-
-
0038363422
-
Dosimetry cup charge, collection in plasma immersion ion implantation,
-
U.S. Patent 6 050 218, Apr. 18
-
J. Chen, P. L. Kellerman, and S. Denholm, "Dosimetry cup charge, collection in plasma immersion ion implantation," U.S. Patent 6 050 218, Apr. 18, 2000.
-
(2000)
-
-
Chen, J.1
Kellerman, P.L.2
Denholm, S.3
-
7
-
-
45949101911
-
Dose monitor for plasma doping system,
-
U.S. Patent 6 528 805, Mar. 4
-
Z. Fang and M. Goeckner, "Dose monitor for plasma doping system," U.S. Patent 6 528 805, Mar. 4, 2003.
-
(2003)
-
-
Fang, Z.1
Goeckner, M.2
-
9
-
-
45949108318
-
SIMS/ARXPS - A new technique of retained dopant dose and profile measurement of ultra-low energy doping processes
-
Monterey, CA, Jun. 8-13
-
S. Qin, K. Zhuang, S. Lu, A. McTeer, W. Morinville, and K. Noehring, "SIMS/ARXPS - A new technique of retained dopant dose and profile measurement of ultra-low energy doping processes," in Proc. 17th Int. Conf. Ion Implant. Technol., Monterey, CA, Jun. 8-13, 2008.
-
(2008)
Proc. 17th Int. Conf. Ion Implant. Technol
-
-
Qin, S.1
Zhuang, K.2
Lu, S.3
McTeer, A.4
Morinville, W.5
Noehring, K.6
-
10
-
-
0028387442
-
An evaluation of contamination from plasma immersion ion implantation on silicon device characteristics
-
Mar
-
S. Qin and C. Chan, "An evaluation of contamination from plasma immersion ion implantation on silicon device characteristics," J. Electron. Mater., vol. 23, no. 3, pp. 337-340, Mar. 1994.
-
(1994)
J. Electron. Mater
, vol.23
, Issue.3
, pp. 337-340
-
-
Qin, S.1
Chan, C.2
-
11
-
-
41749102928
-
6 PIII/PLAD processing
-
Sep
-
6 PIII/PLAD processing," IEEE Trans. Electron Devices, vol. 54, no. 9, p. 2497-2502, Sep. 2007.
-
(2007)
IEEE Trans. Electron Devices
, vol.54
, Issue.9
, pp. 2497-2502
-
-
Qin, S.1
McTeer, A.2
-
12
-
-
29044439118
-
6 plasma diluted with helium on plasma doping process in a pulsed glow-discharge system
-
Nov./Dec
-
6 plasma diluted with helium on plasma doping process in a pulsed glow-discharge system," J. Vac. Sci. Technol. B, Microelectron. Nanometer Struct. Process. Meas. Phenom., vol. 23, no. 6, pp. 2272-2277, Nov./Dec. 2005.
-
(2005)
J. Vac. Sci. Technol. B, Microelectron. Nanometer Struct. Process. Meas. Phenom
, vol.23
, Issue.6
, pp. 2272-2277
-
-
Qin, S.1
McTeer, A.2
Hu, Y.J.3
-
13
-
-
33847368591
-
6 plasma system
-
Apr
-
6 plasma system," Surf. Coat. Technol., vol. 201, no. 15, pp. 6759-676, Apr. 2007.
-
(2007)
Surf. Coat. Technol
, vol.201
, Issue.15
, pp. 6759-7676
-
-
Qin, S.1
McTeer, A.2
|