Determining the inductance of a through-substrate via using multiple on-wafer test approaches

IEEE International Conference on Microelectronic Test Structures

Volumn , Issue , 2001, Pages 147-151

  Uscola, R ^a   Tutt, M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC IMPEDANCE; INTEGRATED CIRCUIT TESTING; MICROSTRIP LINES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SCATTERING PARAMETERS; SEMICONDUCTING GALLIUM ARSENIDE; SILICON WAFERS; SUBSTRATES;

DIRECT MEASUREMENT; ON-WAFER MEASUREMENT; SCATTERING PARAMETER MEASUREMENT; THROUGH SUBSTRATE;

INDUCTANCE MEASUREMENT;

EID: 0034860973     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. LRM and LRRM calibrations with automatic determination load inductance
2. Applying the HP8510B TRL calibration for non-coaxial measurements