Oxide dispersion strengthening of nickel electrodeposits for microsystem applications

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 35 A, Issue 8, 2004, Pages 2351-2360

  Goods, S H ^a   Buchheit, T E ^b   Janek, R P ^c   Michael, J R ^b   Kotula, P G ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

^c Owens Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ANNEALING; DISPERSIONS; ELECTRODEPOSITION; ELECTROFORMING; INDENTATION; LITHOGRAPHY; METAL MOLDING; STRENGTH OF MATERIALS; STRENGTHENING (METAL); SUSPENSIONS (FLUIDS); TENSILE STRENGTH;

MICROSYSTEMS; NANOINDENTATION; NICKEL SULFAMATE BATH; OROWAN STRENGTHENING; OXID DISPERSION;

NICKEL;

EID: 4544298051     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-006-0215-7     Document Type: Article

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