A study of the curing behavior of polyamic acid coated on a Cu or Zn layer

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 324, Issue 1-3, 2008, Pages 122-125

  Dong, Wen Guo ^a   Kim, Gun Hong ^a   Choi, Jae Youn ^a   Yoon, Jun Ro ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Cu2O; Curing; Nanoparticle; Polyimide; ZnO

Indexed keywords

CURING; ZINC; ZINC OXIDE;

CURING BEHAVIORS; POLYAMIC ACID (PAA);

COPPER ALLOYS;

COPPER; COPPER OXIDE; NANOPARTICLE; POLYAMIC ACID; POLYAMINE DERIVATIVE; POLYIMIDE; ZINC;

ARTICLE; CHEMICAL STRUCTURE; DECOMPOSITION; DIFFERENTIAL SCANNING CALORIMETRY; INFRARED SPECTROSCOPY; MATERIAL COATING; PRIORITY JOURNAL; TEMPERATURE; THERMOGRAVIMETRY; TRANSMISSION ELECTRON MICROSCOPY;

EID: 45249111148     PISSN: 09277757     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2008.04.026     Document Type: Article

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