Strain hardening behavior of ultrafine- grained Cu by analyzing the tensile stress-strain curve

Advanced Engineering Materials

Volumn 10, Issue 5, 2008, Pages 434-438

  Huang, Chongxiang ^a   Wu, Shiding ^a   Li, Shouxin ^a   Zhang, Zhefeng ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BEAMS AND GIRDERS; CHARGED PARTICLES; COPPER ALLOYS; CURVES (ROAD); ELECTRON MICROSCOPES; ELECTRON MICROSCOPY; ELECTRON OPTICS; ELECTRONS; HARDENING; IMAGING TECHNIQUES; LITHOGRAPHY; METAL ANALYSIS; METALS; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; MORPHOLOGY; PLASTICITY; STRAIN HARDENING; STRESS-STRAIN CURVES; STRESSES; TENSILE STRESS; TRANSMISSION ELECTRON MICROSCOPY;

(ABIOTIC AND BIOTIC) STRESS; DEFORMATION MECHANISMS; ELECTRON BACK SCATTER DIFFRACTION (EBSD); FLOW STRESSES; HARDENING BEHAVIOR; LONGITUDINAL AXIS; PLASTIC STRAINING; STRESS STRAIN (IGC:D6/ E13); STRESS STRAIN CURVE (SSC); SWIFT EQUATIONS; THIN FOILS; UFG METALS; ULTRAFINE GRAINED (UFG) CU;

TENSILE STRAIN;

EID: 45149099271     PISSN: 14381656     EISSN: 15272648     Source Type: Journal    
DOI: 10.1002/adem.200700324     Document Type: Article

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