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Volumn 503-504, Issue , 2006, Pages 971-976
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Structure and mechanical properties of submicrocrystalline copper produced by ECAP to very high strains
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Author keywords
Copper; EBSD; ECAP; Mechanical properties; Microstracture; Thermal stability
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Indexed keywords
CRYSTALLOGRAPHY;
GRAIN BOUNDARIES;
MICROSTRUCTURE;
PLASTIC DEFORMATION;
TENSILE STRAIN;
THERMODYNAMIC STABILITY;
CRYSTALLOGRAPHIC TEXTURES;
SEVERE PLASTIC DEFORMATION;
SUBMICROCRYSTALLINE COPPER;
TENSILE DUCTILITY;
COPPER;
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EID: 33845445894
PISSN: 02555476
EISSN: 16629752
Source Type: Book Series
DOI: 10.4028/0-87849-985-7.971 Document Type: Conference Paper |
Times cited : (26)
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References (12)
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