The effect of strain path and temperature on the microstructure developed in copper processed by ECAE

Materials Science and Engineering: A

Volumn 366, Issue 2, 2004, Pages 221-228

  Huang, W H ^a   Yu, C Y ^a   Kao, P W ^a   Chang, C P ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Copper; Dynamic recrystallization; Equal channel angular extrusion; Microstructure

Indexed keywords

ALUMINUM; BILLETS (METAL BARS); GRAIN SIZE AND SHAPE; METAL EXTRUSION; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); STRAIN;

EQUAL CHANNEL ANGULAR EXTRUSION (ECAE);

COPPER;

COPPER; MICROSTRUCTURE;

EID: 0346724781     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.08.033     Document Type: Article

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