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Volumn 3, Issue , 2006, Pages 1543-1546

An inductor with taper stacked metals on silicon chip

Author keywords

CMOS integrated circuits; Inductors; Q factor; Semiconductor devices

Indexed keywords

EDDY CURRENTS; ELECTROMAGNETISM; INDUCED CURRENTS; LITHOGRAPHY; MAGNETISM; METALS; MICROWAVES; NONMETALS; SILICON;

EID: 44949209516     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APMC.2006.4429700     Document Type: Conference Paper
Times cited : (1)

References (13)
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    • Yue, C.P.1    Wong, S.S.2
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    • L.F. Tiemeijer, D. Leenaerts, N. Pavlovic, and R.J. Havens, Record Q spiral inductors in standard CMOS, 2001 IEDM Technical Digest, pp. 40.7.1-40.7.3, Dec. 2001.
    • L.F. Tiemeijer, D. Leenaerts, N. Pavlovic, and R.J. Havens, "Record Q spiral inductors in standard CMOS," 2001 IEDM Technical Digest, pp. 40.7.1-40.7.3, Dec. 2001.
  • 9
    • 0036687251 scopus 로고    scopus 로고
    • High Q multilayer spiral inductor on silicon chip for 5 - 6 GHz
    • Aug
    • G. Lihui, Y. Mingbin, C. Zhen, H. Han, and Z. Yi, "High Q multilayer spiral inductor on silicon chip for 5 - 6 GHz," IEEE Electron Device Letters, vol. 23, no. 8, pp. 470-472, Aug. 2002.
    • (2002) IEEE Electron Device Letters , vol.23 , Issue.8 , pp. 470-472
    • Lihui, G.1    Mingbin, Y.2    Zhen, C.3    Han, H.4    Yi, Z.5
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    • A comprehensive compact-modeling methodology for spiral inductors in silicon-based RFICs
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    • A.C. Watson, D. Melendy, P. Francis, K. Hwang, and A. Weisshaar, "A comprehensive compact-modeling methodology for spiral inductors in silicon-based RFICs," IEEE Trans. Microwave Theory & Tech., vol. 52, no. 3, pp. 849-857, Mar. 2004.
    • (2004) IEEE Trans. Microwave Theory & Tech , vol.52 , Issue.3 , pp. 849-857
    • Watson, A.C.1    Melendy, D.2    Francis, P.3    Hwang, K.4    Weisshaar, A.5
  • 13
    • 0032294293 scopus 로고    scopus 로고
    • B.K. Sen and R.L. Wheeler, Skin effects models for transmission line structures using generic SPICE circuit simulators, IEEE 7th topical Meeting on Electrical Performance of Electronic Packaging, pp. 128-131, Oct. 1998.
    • B.K. Sen and R.L. Wheeler, "Skin effects models for transmission line structures using generic SPICE circuit simulators," IEEE 7th topical Meeting on Electrical Performance of Electronic Packaging, pp. 128-131, Oct. 1998.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.