Influence of IMC on the interface failure of tin-silver-copper solder joints

Jixie Qiangdu/Journal of Mechanical Strength

Volumn 27, Issue 5, 2005, Pages 666-671

  Li, Xiaoyan ^a   Yan, Yongchang ^a   Shi, Yaowu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Electronic package; Fracture; Intermetallic compound (IMC); Lead free solder; Surface mounting technology (SMT)

Indexed keywords

EID: 27244438399     PISSN: 10019669     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (30)