3-D electronics interconnect for high-performance imaging detectors

IEEE Transactions on Nuclear Science

Volumn 51, Issue 4 I, 2004, Pages 1829-1834

  Kwiatkowski, Kris ^a   Lyke, Jim ^b   Wojnarowski, Robert ^c   Kapusta, Chris ^c   Kleinfelder, Stuart ^d   Wilke, Mark ^a  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

^c GE GLOBAL RESEARCH   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

3 D interconnect; Adaptive lithography; Die stacking; Fast imagers; HDI; Polymer bump bonding

Indexed keywords

ADAPTIVE LITHOGRAPHY; DIE STACKING; FAST IMAGERS; HIGH-DENSITY INTERCONNECT (HDI); POLYMER BUMP BONDING;

CHARGE COUPLED DEVICES; CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; FLIP CHIP DEVICES; IMAGE PROCESSING; OPTICAL FIBERS; PROTON BEAMS; QUANTUM EFFICIENCY;

LARGE SCALE SYSTEMS;

EID: 4444361262     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNS.2004.832712     Document Type: Conference Paper

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